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USB BDM Pod for S08,HC12,S12(X),CF V1breakout board, TSSOP or SOIC to 14-pin DIP

breakout board, SSOP28 to 28-pin DIP
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breakout board, SSOP28 to 28-pin DIP

Order Code: DIP2SSOP28
Price: USD $1.65

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Product Info

   This is a blank breakout board with a surface-mount pattern for SSOP devices up to 28 pins. Two rows of pads are provided, on 0.1" centers, to accommodate standard 0.025" square pins, round pins, or wires. Distance between the two rows of pads is 0.6", designed to plug into a standard wide DIP socket or a solderless breadboard. Manufactured by ETT (Thailand).

Features:

  • suitable for use with any chip supplied in a 20-pin to 28-pin SSOP package
  • direct one-to-one pin-numbering
  • solder-masked and plated for easier chip mounting


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